Description Nano-Master Main Equipment: Thin Film | Etch | Cleaning | Space Simulation | Hybrid NEE-4000 E-Beam Systems Electron Beam Evaporation (Download Brochure) The Electron Beam Evaporation System is available in two different configurations. A compact vertical dual chamber configuration features a 14″ cube main chamber where the platen is located, and underneath the main chamber a secondary chamber is provided for housing the e-beam source. This configuration can be provided with a gate valve between the two chambers to be used as a load lock to keep the e-beam source and the evaporation pockets in vacuum while substrates are loaded and unloaded from the main chamber. For applications where automatic loading and unloading of wafers are needed, a third load lock chamber is attached to the left face of the cube for another load lock. In this case, the main chamber can be kept at low 10-7 Torr range at all times and evaporation can start just a few minutes after loading the wafer. The second configuration features a single large chamber design that allows e-beam evaporation guns, magnetrons, and thermal evaporation mounted onto the baseplate. In this configuration coating of mulitple wafers are possible using planetary substrate holder.NANO-MASTER offers combinatorial evaporation system using substrate masking and computer controlled evaporation rates for individual e-beam evaporators Features: Electropolished 14” cubical or 21”x21”x22” 304L SS chamber 5×10-7 Torr base pressure attained with turbomolecular pumping package 4x 15cc pocket E-gun Source and substrate shutters 6kW and 10kW switching power supply Automatic pocket indexing Programmable sweep controller 26” x 44” footprint with SS panels for Class 100 cleanrooms Quartz crystal thickness sensor Substrate rotation LabVIEW user interface EMO protection and safety interlocks Options Substrate heating up to 800°C or cooling Glancing Angle Deposition (GLAD) with rotation Planetary substrate holder Substrate RF/DC bias Dual e-beam source for co-evaporation Ion source for substrate cleaning and ion assisted evaporation Additional PVD sources (thermal, sputtering) MFC’s for reactive evaporation Automatic load/unload Applications: Lift Off Optical Coatings Thin Film Transistors Active CIGS layer Josephson Junctions The trademarks of the equipment and parts contained on this page belong to the Original Equipment Manufacturers. Please contact us for more information on the product: Your Name*: Your Email: Your Message: Captchac Code Submit: [dynamichidden dynamichidden-813 "CF7_URL"] Δ Nano-Master Main Equipment: Thin Film | Etch | Cleaning | Space Simulation | Hybrid SS10840 Share the post "NEE-4000 E-Beam Evaporator" FacebookXShare…
